SPRINGER FEATURE PROFILE EVOLUTION IN PLASMA PROCESSING USING ON WAFER MONITORING SYSTEM 2014 RETAIL EBOOK-kE
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SPRINGER.FEATURE.PROFILE.EVOLUTION.IN.PLASMA.PROCESSING.USING.ON.WAFER.MONITORING.SYSTEM.2014.RETAIL.EBOOK-kE
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Description
TITLE: FEATURE PROFILE EVOLUTION IN PLASMA PROCESSING USING
ON-WAFER MONITORING SYSTEM
PUBLISHER: SPRINGER LANGUAGE: ENGLISH
LINK: http://is.gd/xvt4Sh RELEASE TYPE: RETAIL
FORMAT: PDF RELEASE DATE: 2015.01.28
ISBN: 9784431547952 STORE DATE: 2014
SAVED.MONEY: 42 EURO DISKCOUNT: 01 x 05MB
AUTHOR: SAMUKAWA, SEIJI
BOOK
This book provides for the first time a good understanding of the
etching profile technologies that do not disturb the plasma
Three types of sensors are introduced: on-wafer UV sensors
on-wafer charge-up sensors and on-wafer sheath-shape sensors in
the plasma processing and prediction system of real etching
profiles based on monitoring data. Readers are made familiar with
these sensors, which can measure real plasma process surface
conditions such as defect generations due to UV-irradiation, ion
flight direction due to charge-up voltage in high-aspect ratio
structures and ion sheath conditions at the plasma/surface
interface. The plasma etching profile realistically predicted by
a computer simulation based on output data from these sensors is
described
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